By I︠U︡ G Gogot︠s︡i; Vladislav Domnich
"High-Pressure floor technology and Engineering could be a vital source for complex scholars and researchers engaged on any point of high-pressure study, touch mechanics, tribology or fabrics technology the place mechanical floor interactions are a factor."--BOOK JACKET.
content material: Sect. 1. section Transitions caused through Mechanical Compression --
creation: High-pressure floor technological know-how and engineering --
a brand new zone of analysis --
Ch. 1. section transitions precipitated by means of mechanical compression / John J. Gilman --
Sect. 2. Simulation of Pressure-Induced part changes --
Ch. 2.1. touch mechanics types accounting for section changes / Boris A. Galanov and Vitaliy M. Kindrachuk --
Ch. 2.2. Molecular dynamics simulation of part differences in monocrystalline silicon / L. C. Zhang and W. C. D. Cheong --
Ch. 2.3. High-pressure levels of team IV and III-V semiconductors / Graeme J. Ackland --
Sect. three. Continuum Mechanical basics of Mechanochemistry
summary: "High-Pressure floor technological know-how and Engineering should be an important source for complicated scholars and researchers engaged on any element of high-pressure examine, touch mechanics, tribology or fabrics technology the place mechanical floor interactions are a factor."--BOOK JACKET
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Extra info for High-pressure surface science and engineering
E. τ = Y/2) because the plastic deformations appear on the boundary ABA∗ . Therefore, Y = 32 H M. 1). Therefore, the phase transformations originate on the boundary ACA∗ under the stresses: τ = 34 H M = p = H M. Y 2 Because the volume changes for plastic deformations are too small in comparison with the volume changes for other deformation modes, in the following sections we neglect them during the derivation of the model equations. Therefore, the forecasts of the model are not dependent on the load–unload rates.
9). The substrate is considered to be the elastic half-space as long as the contact region is assumed to be small in comparison with the size of the substrate. e. its thickness δ must be less than the characteristic size of the contact region a (δ a). Therefore, it is assumed that the stresses are distributed uniformly deep down within the coating and σ3c = σ3s = − p where σ3s , σ3c are the stresses on the substrate boundary and within of the coating, respectively; p is the contact pressure. 9).
Hence, for the average thickness of the new phase layer under the indenter, we obtain sin ψ HM δ= (1 − ) cot ψ − a. 5) 3 k E∗ From here, we can estimate the depth of the phase transformation zone b. 3) can be presented as 1 3 HM 1 πb 2 πa cot ψ = πa 3 (b + 3a 2 ). 6) is a cubic equation in the unknown b. We make a substitution b = βa, where β is a new unknown (the relative depth of the phase transformation zone). 7) 2 HM − cot ψ ≤ 0. 8) 2 2 q= 2 where Q = 1 + q2 . 9) 2 and P = πk E ∗ cot ψ − β(3 + β 2 ) tan2 ψ h 2 .